Protects the front-side structures from contamination during wafer back-grinding, with excellent heat resistance and protection. UV irradiation lowers the adhesion so the tape peels off without residue.
Supplier: Taiwan
Dicing Tape
For wafer dicing and die pick-up, with stable adhesion and excellent elongation. Adhesion can be reduced by UV irradiation or thermal foaming release to improve pick-up efficiency.
Supplier: Taiwan
QFN Tape
For QFN (quad flat no-lead) packaging to prevent epoxy bleed. Special silicone adhesive on PI film — stable at high temperature and residue-free.
Supplier: Taiwan
Heat-resistant Tape
Holds and protects workpieces and components in heated processes. High heat resistance keeps it stable at high temperatures, and it peels off without residue afterwards.
Supplier: Taiwan
Thermal Release Tape
Special adhesive with high tack and stability for many processes. After processing, heating to a set temperature lowers the adhesion so it releases easily without residue.
Supplier: Taiwan
Double-sided Tape
Two adhesive layers — one high-tack, one residue-free — to suit different bonding surfaces. Strong adhesion yet easy to peel; ideal for processes that fix and then remove materials.
